Objective To investigate the long-term effects of induction therapy with adalimumab (ADA)
plus methotrexate (MTX) in comparison with placebo (PBO) plus MTX in DMARD-naïve …

This document explains different approaches to integrating electronics in textiles. It
discusses reliability standards and tests for electronics in textiles. Encapsulation …

Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in
microelectronics. Mold embedding for this technology is currently done on wafer level up to …

Fan-out wafer level packaging (FOWLP) is one of the latest packaging trends in
microelectronics. Besides technology developments towards heterogeneous integration …

Background Emergency departments continuously provide medical treatment on a walk-in
basis. Several studies investigated the patient's perception of the doctor-patient relationship …

Objective The development of sufficient COVID-19 vaccines has been a big breakthrough in
fighting the global SARS-CoV-2 pandemic. However, vaccination effectiveness can be …

Objectives Hand osteoarthritis (OA) is a condition characterised by cartilage degradation
and frequently erosive changes. Analgesics and non-steroidal anti-inflammatory drugs are …

Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in
microelectronics. Besides technology developments towards heterogeneous integration …

Flip Chip technology has been widely accepted within microelectronics as a technology for
maximum miniaturization. Typical applications today are mobile products such as cellular …

The constant drive to further miniaturization and heterogeneous system integration leads to
a need for new packaging technologies which also allow large area processing and 3D …